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Structure：Partially / fully embedded

Min coin size：2*2（mm)

Min coin thickness：0.5mm

Flatness between coin and base material：≤0.075mm

Material：AIN

Embedded Ceramic size：20*20（mm)

Professional technical support for thermal management：

Material：High TG, high thermal conductivity material

Dielectric thickness：≥0.09mm

Inner layer copper：≤18 OZ

Max layer count：24 layers

Featured product：Thick copper stepped board

Max board size：1100mm X 610mm

Max board thickness：6.5mm

Max aspect ratio：25:1

Material：Panasonic, TUC, Isola

Barck drill accurancy：≤0.15mm

Technologies：Back drill + resin filling

Back drill board thickness：≤6.5mm

Bus bar material：Pure copper

Min conductor space：0.8mm

Copper thickness：1.0mm-3.0mm

Board thickness：2.0mm-10.0mm